Chip Quik Smooth Flow Low Temp Solder Paste Sn42/Bi57/Ag1 T4 10g Syringe
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Description
🔥 Melt the competition with precision and speed!
- PREMIUM ALLOY COMPOSITION - Sn42/Bi57/Ag1 blend ensures smooth, reliable solder joints every time
- TRUSTED CHIP QUIK QUALITY - Industry-leading brand recognized by pros for consistent performance
- EFFORTLESS LOW TEMP MELTING - Saves time and protects sensitive components with a 138°C melting point
- OPTIMIZED FOR REWORK REPAIR - Ideal for quick fixes and delicate electronics without overheating
- PRECISION APPLICATION SYRINGE - 10g syringe design offers controlled, mess-free dispensing for professional results
Chip Quik Smooth Flow Low Temp Solder Paste NC191LTA10 is a 10g syringe of Sn42/Bi57/Ag1 alloy solder paste designed for low-temperature melting at 138°C. It offers precise application and superior flow, making it perfect for delicate electronics rework and repair, trusted by professionals for consistent, high-quality solder joints.
Specifications
| Asin | B096BMCXHX |
| Best Sellers Rank | #139,850 in Home Improvement (See Top 100 in Home Improvement) #158 in Solder Fluxes |
| Country Of Origin | USA |
| Importer | ATM RETAIL 1st Floor Beside P and T Building Lakdi Ka Pul Hyderabad Telangana 500004 |
| Item Model Number | NC191LTA10 |
| Item Weight | 10 g |
| Manufacturer | Chip Quik |
| Package Dimensions | 9.9 x 5.8 x 1.7 cm; 10 g |
Reviews
User
Excellent product, Recommend for Beginners and Professionals Alike
This Solder Paste whilst may seem a bit expensive is a really good product and worth the money in my opinion.It's easy to use and makes working on small circuit boards a breeze, whether you are placing new components on a fresh PCB, reflowing, removing components or resoldering it is great. Working at lower temperatures means less chance of damaging the components, pads etc.It is definitely one of the best I've used so far it seems to go along way, has a good amount of flux in the mix and cleaning was easy afterwards.
User
Works well as low temp solder
First time using solder paste after 25+ years. Nice that it shipped with two nozzles. I did manual soldering.Needed to remember to release extra paste till see liquidish substance coming out. Spread the paste on pads, not too thick. Do not worry if it touches adjacent pads. Pressed ADXL345 LGA chip onto the pads. Used 150 deg C heat gun. The paste solder melted in a few seconds and chip just sat there. Very nice result. Never using solder for chips with funky pads. Good product.
User
Super
Una gran ayuda
User
Works to remove heat sensitive components from circuit boards.
This is an excellent way to remove electronic components from heat sensitive circuit boards. You can achieve solder melt at temperatures around 300 degrees F. Just apply over top of the leads on lead or lead free solder and using a hot air rework machine bring the area up to around 300 degrees F. The solder paste will blend with the solder on the board and allow you to remove the component without excessive heat. Always re-tin the pads the original solder and wick off to remove any residue of the bismuth from the removal.
User
Solder paste
Great product.
Common Questions
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